Adaptive inset for wafer cassette system

ABSTRACT

The present disclosure, in some embodiments, relates to a method of transporting a semiconductor wafer. The method includes transferring a semiconductor wafer into a first wafer slot of a second plurality of wafer slots within an adaptive inset. The adaptive inset is arranged within an interior cavity of a wafer cassette having a first plurality of wafer slots while transferring the semiconductor wafer into the first wafer slot. The wafer cassette and the adaptive inset are transported into a loading port of a semiconductor processing tool configured to perform a fabrication process on the semiconductor wafer.

REFERENCE TO RELATED APPLICATION

This application is a Continuation of U.S. patent application Ser. No.15/288,155, filed on Oct. 7, 2016, which claims the benefit of U.S.Provisional Application No. 62/272,208, filed on Dec. 29, 2015. Thecontents of the above-referenced patent applications are herebyincorporated by reference in their entirety.

BACKGROUND

Integrated chips are fabricated in semiconductor fabrication facilitiesor fabs. Fabs contain processing tools that are configured to perform aplurality of processing steps (e.g., etching steps, lithography steps,deposition steps, etc.) upon a semiconductor wafer (e.g., a siliconwafer). To protect wafers from damage, wafers are generally transferredbetween different processing tools using wafer cassettes.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A-1B illustrate some embodiments of a wafer cassette systemhaving an adaptive inset configured to hold semiconductor wafers.

FIGS. 2A-2B illustrate some additional embodiments of a wafer cassettesystem having an adaptive inset configured to hold semiconductor wafers.

FIGS. 3A-3C illustrates some embodiments of a wafer cassette systemhaving an adaptive inset fastened into a wafer cassette by a pluralityof screws.

FIG. 4 illustrates a cross-sectional view of some embodiments of a wafercassette system comprising an adaptive inset fastened into a wafercassette by one or more support structures and one or more screws.

FIGS. 5A-5B illustrate some additional embodiments of a wafer cassettesystem comprising an adaptive inset fastened into a wafer cassette bysupport structures and screws.

FIG. 6 illustrates a three-dimensional view of some embodiments of awafer cassette system having an adaptive inset configured to holdsemiconductor wafers.

FIG. 7 a block diagram illustrating a semiconductor fabrication systemconfigured to transfer semiconductor wafers using a wafer cassettesystem having an adaptive inset configured to hold a plurality ofsemiconductor wafers.

FIG. 8 illustrates a flow diagram of some embodiments of a method ofsemiconductor processing that transfers semiconductor wafers using awafer cassette system having an adaptive inset configured to holdsemiconductor wafers.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Typically, integrated chip processing tools within a fabricationfacility are configured to receive semiconductor wafers held in a wafercassette. However, some processing tools are not able to receivedifferent sizes of wafer cassettes. For example, a processing tool maybe able to receive a wafer cassette configured to hold 300 mm wafers,but not a wafer cassette configured to hold 200 mm wafers. Not beingable to receive different wafer cassettes limits a processing tool'susefulness and requires different processing tools to be used fordifferent diameter wafers, thereby increasing the cost of integratedchip fabrication.

The present disclosure relates to a wafer cassette system comprising anadaptive inset configured to enable semiconductor wafers having a firstdiameter to be held by a wafer cassette configured to hold semiconductorwafers having a second diameter that is larger than the first diameter.The wafer cassette system comprises a wafer cassette having a firstplurality of wafer slots configured to receive one or more semiconductorwafers having a first diameter. An adaptive inset is arranged in aninterior cavity of the wafer cassette. The adaptive inset comprises asecond plurality of wafer slots configured to receive one or moresemiconductor wafers having a second diameter that is less than thefirst diameter. The adaptive inset allows for the wafer cassette to holdsemiconductor wafers having the second diameter, thereby enablingsemiconductor processing tools to processes semiconductor wafer having adifferent diameter than those able to be held by wafer cassettes thatthe tools can receive.

FIGS. 1A-1B illustrate some embodiments of a wafer cassette systemhaving an adaptive inset configured to hold semiconductor wafers.

As shown in cross-sectional view 100, the wafer cassette systemcomprises a wafer cassette 102 having a first plurality of wafer slots103 configured to hold a plurality of semiconductor wafers 112 having afirst diameter. The wafer cassette 102 defines a first interior cavity104 of the wafer cassette 102. As shown in top-view 114, the firstinterior cavity 104 is in communication with a first opening arrangedalong one side of the wafer cassette 102. The first interior cavity 104has a first width w₁ that enables the wafer cassette 102 to receive theplurality of semiconductor wafers having the first diameter. Forexample, in some embodiments, a first width w₁ may be approximately 200mm, so that the first plurality of wafer slots 103 are able to hold 200mm wafers.

An adaptive inset 106 is arranged in the first interior cavity 104 ofthe wafer cassette 102. As shown in cross-sectional view 100, theadaptive inset 106 is connected to the wafer cassette 102 by way of oneor more fastening elements 110 that provide for a rigid connectionbetween the adaptive inset 106 and the wafer cassette 102. In someembodiments, the wafer cassette 102 and the adaptive inset 106 maycomprise a same material.

The adaptive inset 106 has second interior cavity 108 with a secondwidth w₂ that is less than the first width w₁. The second width w₂ ofthe second interior cavity 108 causes the adaptive inset 106 to have asecond plurality of wafer slots 107 configured to hold a plurality ofsemiconductor wafers 112 having a second diameter that is less than thefirst diameter. For example, in some embodiments, the second width w₂may be approximately 150 nm, so that the second plurality of wafer slots107 are able to hold 150 mm wafers. As shown in top-view 114, the secondinterior cavity 108 is in communication with a second opening arrangedalong one side of the adaptive inset 106. The first opening and thesecond opening face the same direction.

The adaptive inset 106 is configured to adjust a diameter of asemiconductor wafer that the wafer cassette 102 is able to hold byadjusting a width of wafer slots configured to hold a semiconductorwafer. For example, the adaptive inset 106 allows for a wafer cassette102 that is configured to hold a first wafer diameter (e.g., a 200 mmwafer), to hold a second wafer diameter (e.g., a 150 mm wafer). Byadjusting a size of wafers that the wafer cassette 102 is able to hold,the adaptive inset 106 enables processing tools, which are configured toreceive a single size of wafer cassette, to receive multiple sizes ofwafers (e.g., wafers having a diameter that is different than that whichthe wafer cassette is configured to hold).

FIGS. 2A-2B illustrate some additional embodiments of a wafer cassettesystem 200 having an adaptive inset configured to hold a plurality ofsemiconductor wafers.

As shown in the cross-sectional view of FIG. 2A, the wafer cassettesystem 200 includes a wafer cassette 102. The wafer cassette 102comprises a first plurality of wafer slots 103 arranged between a firstplurality of separation ridges 202, and having a first sizecorresponding to a diameter of a wafer to be received by the wafercassette 102. The first plurality of separation ridges 202 extend alonga perimeter of the first plurality of wafer slots 103. Respective onesof the first plurality of wafer slots 103 are arranged between a firstpair 204 of adjacent ones of the first plurality of separation ridges202. The first plurality of separation ridges 202 are connected to oneor more support bars 206 that vertically extend between upper and lowersurfaces of the wafer cassette 102. Connecting the first plurality ofseparation ridges 202 to the one or more support bars 206 gives thefirst plurality of wafer slots 203 a constant spacing between adjacentones of the first plurality of separation ridges 202.

An adaptive inset 106 is nested substantially within the wafer cassette102. The adaptive inset 106 comprises a second plurality of wafer slots107 arranged between a second plurality of separation ridges 208, andhaving a second size corresponding to a diameter of a wafer to bereceived by the adaptive inset 106. The second size is smaller than thefirst size. In some embodiments, the first plurality of separationridges 202 may have different cross-sectional shapes than the secondplurality of separation ridges 208. In other embodiments, the firstplurality of separation ridges 202 and the second plurality ofseparation ridges 208 may have a same cross-sectional shape. Respectiveones of the second plurality of wafer slots 107 are arranged between asecond pair 210 of adjacent ones of the second plurality of separationridges 208. In some embodiments, the first pair 204 of adjacent ones ofthe first plurality of separation ridges 202 are separated by a firstspace S₁ and the second pair 210 of adjacent ones of the secondplurality of separation ridges 208 are separated by a second space S₂that is smaller than the first space S₁.

The second plurality of separation ridges 208 extend along a perimeterof the second plurality of wafer slots 107. In some embodiments, thefirst plurality of wafer slots 103 are vertically offset from the secondplurality of wafer slots 107. The second plurality of separation ridges208 are connected to support bars 212 that vertically extend betweenupper and lower surfaces of the adaptive inset 106. Connecting thesecond plurality of separation ridges 208 to the one or more supportbars 212 gives the second plurality of wafer slots 107 a constantspacing between adjacent ones of the second plurality of separationridges 208. Since the adaptive inset 106 is nested substantially withinthe wafer cassette 102, second plurality of wafer slots 107 provide thewafer cassette 102 the ability to hold wafers corresponding to thesecond size.

The wafer cassette 102 is fastened to the adaptive inset 106 by way ofone or more fastening elements 110. The fastening elements 110 areconfigured to hold the adaptive inset 106 at a fixed position withrespect to the wafer cassette 102. In some embodiments, the one or morefastening elements 110 may comprise a screw, a pin, an adhesive (e.g.,glue, epoxy, etc.), a solder, etc. In various embodiments, the one ormore fastening elements 110 may be arranged along lower surface and/orupper exterior surface of the wafer cassette 102. In some embodiments,the one or more fastening elements 110 comprise a screw extendingthrough surfaces of the wafer cassette 102 and the adaptive inset 106.

As illustrated in top-view 214 of FIG. 2B, the wafer cassette 102comprises a first opening 216 arranged along a first of the wafercassette 102 and having a width that extends between support bars 206located on opposing sides of the first opening 216. In some embodiments,additional support bars may also be located at different positionsaround the first plurality of separation ridges 202. In someembodiments, the wafer cassette 102 may further comprise a secondopening 218 arranged along a back-side of the wafer cassette 102. Thesecond opening 218 has a smaller width than the first opening 216.

The adaptive inset 106 comprises a third opening 220 arranged along afront-side of the adaptive inset 106 and a forth opening 222 arrangedalong a back-side of the adaptive inset 106. The third opening 220 has awidth that extends between support bars 212 of the adaptive inset 106.In some embodiments, the first opening 216 is arranged within a firstside surface of the wafer cassette 102 and the second opening isarranged within a second side surface of the adaptive inset 106 that islaterally set back from the first side surface by a non-zero distance226.

The wafer cassette 102 has one or more interior surfaces (e.g.,sidewalls) contacting one or more exterior surfaces (e.g., sidewalls) ofthe adaptive inset 106 at one or more contact points 224. In someembodiments, one or more of the contact points 224 may be arranged alongthe first plurality of separation ridges 202 and the support bars 212and/or along the second plurality of separation ridges 208 and thesupport bars 206.

FIGS. 3A-3C illustrates some embodiments of a wafer cassette systemhaving an adaptive inset fastened into a wafer cassette by a pluralityof screws.

As shown in top-view 300, an adaptive inset 106 is arranged in aninterior cavity of a wafer cassette 102. One or more screws 302 areconfigured to fasten the adaptive inset 106 in a fixed relation to thewafer cassette 102. The one or more screws 302 are arranged along anupper surface of the wafer cassette 102. As shown in cross-sectionalview 304 (taken along cross-sectional line A-A′ of FIG. 3A), the one ormore screws 302 extend through upper surfaces of the wafer cassette 102and the adaptive inset 106. In some embodiments, the one or more screws302 comprise a threaded exterior surface 306 that extends into the wafercassette 102 and the adaptive inset 106. In some embodiments, the one ormore screws 302 may protrude outward from a lower interior surface 308of the adaptive inset 106.

In some embodiments, the one or more screws 302 may comprise a materialthat is able to undergo high temperatures without damage, such asstainless steel. In some embodiments, the one or more screws 302 maycomprise vacuum screws, which respectively comprise a hole that extendsfrom a top surface of a screw to a bottom of the screw to provide a pathfor trapped gases to be removed from the bottoms, sides, and shouldersof blind-tapped holes within the wafer cassette 102 and/or the adaptiveinset 106, thereby allowing for an improved vacuum within a vacuumchamber. In some embodiments, the holes may extend along a central axisof the screw. In other embodiments, the holes may extend along an edgeof the screw.

In various embodiments, the one or more screws 302 may comprise anynumber of screws. For example, in some embodiments, the one or morescrews 302 may comprise three screws. In other embodiments, the one ormore screws 302 may comprise more than three screws. In someembodiments, the one or more screws 302 are located at positions thatare offset from a handle (not shown) arranged along the upper surface ofthe wafer cassette 102.

FIG. 3C illustrates a three-dimensional view 310 of the adaptive inset106, which shows the one or more screws 302 exposed along the lowerinterior surface 308 of the adaptive inset 106.

FIG. 4 illustrates a cross-sectional view of some embodiments of a wafercassette system 400 comprising an adaptive inset fastened into a wafercassette by one or more support structures and one or more screws.

The wafer cassette system 400 comprises an adaptive inset 106 arrangedin an interior cavity of a wafer cassette 102. The adaptive inset 106has an upper outer surface 106 u that contacts an upper interior surface102 u of the wafer cassette 102 at one or more contact points 402. Insome embodiments, the upper interior surface 102 u of the wafer cassette102 may comprise an angled surface (i.e., a surface that is angled withrespect to support bars 206 at an acute angle greater than zero). Insome embodiments, the adaptive inset 106 may comprise one or more screws302 that extend through upper surfaces of the wafer cassette 102 and theadaptive inset 106. In some embodiments, the one or more screws 302 maybe positioned at a location that is laterally offset from the one ormore contact points 402. This results in the one or more screws 302extending through a gap 404 between the wafer cassette 102 and theadaptive inset 106.

The adaptive inset 106 also has a lower exterior surface 106L thatcontacts one or more support structures 406. The one or more supportstructures 406 are arranged between a lower interior surface 102L of thewafer cassette 102 and the lower exterior surface 106L of the adaptiveinset 106. In some embodiments, the one or more support structures 406may vertically extend from the lower interior surface 102L of the wafercassette 102 past one or more of a first plurality of separation ridges202 of the wafer cassette 102. The one or more support structures 406comprise a rigid material that is configured to provide structuralsupport to the adaptive inset 106, so that the adaptive inset 106 isrigidly fixed in the wafer cassette 102. In various embodiments, the oneor more support structures 406 may comprise a plastic or a metal (e.g.,stainless steel), for example. In some embodiments, the one or moresupport structures 406 may comprise blocks having a substantially squareor rectangular cross-sectional shape.

In some embodiments, the lower exterior surface 106L of the adaptiveinset 106 may comprise a ridge 408 that extends in a direction thatintersects the one or more support structures 406. In such embodiments,the one or more support structures 406 may have a slot (i.e.,depression) arranged within the upper surface of the support structures406. The slot is configured to laterally and vertically contact theridge 408, thereby providing for increased lateral support of theadaptive inset 106.

FIGS. 5A-5B illustrate some additional embodiments of a wafer cassettesystem comprising an adaptive inset fastened into a wafer cassette bysupport structures and screws.

As shown in cross-sectional view 500 of FIG. 5A and three-dimensionalview 506 of FIG. 5B, a first group of one or more screws 302 extendthrough upper surfaces of a wafer cassette 102 and an adaptive inset106. A second group of one or more screws 502 extend through the one ormore support structures 406 and lower surfaces of the wafer cassette 102and the adaptive inset 106. In some embodiments, the second group of oneor more screws 502 may respectively comprise a vacuum screw having ahole surrounded by an outer rim. In some embodiments, the second groupof one or more screws 502 may protrude outward from a lower interiorsurface 504 of the adaptive inset 106. The second group of one or morescrews 502 are configured to hold the one or more support structures 406and the adaptive inset 106 in place within an interior cavity of thewafer cassette 102.

FIG. 6 illustrates a three-dimensional view 600 of some embodiments of awafer cassette system having an adaptive inset configured to holdsemiconductor wafers. The three-dimensional view 600 illustrates some ofthe embodiments described above in relation to FIGS. 1A-5B.

FIG. 7 illustrates some embodiments of a block diagram illustrating asemiconductor fabrication system 700 configured to transfersemiconductor wafers using a wafer cassette system having an adaptiveinset configured to hold a plurality of semiconductor wafers.

The semiconductor fabrication system 700 comprises an automated wafertransfer tool 702 configured to transfer a semiconductor wafer 704 toone of a plurality of wafer slots within an adaptive inset 106 arrangedin a wafer cassette 102. In some embodiments, the automated wafertransfer tool 702 may be configured to automatically transfer thesemiconductor wafer 704 from a first processing tool to the adaptiveinset 106. In other embodiments, the automated wafer transfer tool 702may be configured to automatically transfer the semiconductor wafer 704from a first wafer cassette to the adaptive inset 106. In someembodiments, the automated wafer transfer tool 702 may be able totransfer wafers having a larger diameter than the semiconductor wafer704. For example, in some embodiments, the automated wafer transfer tool702 may be able to transfer 200 mm wafers, while the semiconductor wafer704 may be a 150 mm wafer.

The wafer cassette 102 and the adaptive inset 106 are transferred to aninlet 710 of a semiconductor processing tool 708. In some embodiments,the wafer cassette 102 may be transferred to the semiconductorprocessing tool 708 by way of a conveyer system 706. For example, insome embodiments, the wafer cassette 102 may be transported by overheadtransport (OHT) vehicles that travel on rails. The OHT vehicles may beconfigured to raise the wafer cassette 102 of loading ports of a firsttool, to laterally move the wafer cassette along the rails, and/or tolower the wafer cassette to the loading port of a tool.

The semiconductor processing tool 708 comprises a loading port 712 incommunication with the conveyer system 706 and configured to receive thewafer cassette 102. In some embodiments, the loading port 712 is coupledto a vacuum pump 713 configured to generate a vacuum within the loadingport 712. In some embodiments, the adaptive inset 106 has a first size(e.g., length, width, and/or depth) and the wafer cassette 102 has asecond size (e.g., length, width, and/or depth) that is greater than thefirst size. In some embodiments, the loading port 712 is not able toreceive a wafer cassette having the first size (i.e., the loading port712 would not be able to receive a wafer cassette that is configured tohold the semiconductor wafer 704, but is able to receive the wafercassette 102 having the adaptive inset 106 holding the semiconductorwafer 704). Therefore, in such embodiments, the adaptive inset allowsfor the semiconductor processing tool 708 to receive semiconductorwafers having a diameter that otherwise would not be able to bereceived.

A wafer transfer robot 714 is configured to remove the semiconductorwafer 704 from the wafer cassette 102 and to provide the semiconductorwafer 704 to a processing element 716 that is configured to perform asemiconductor process on the semiconductor wafer 704. In someembodiments, the wafer transfer robot 714 comprises a robot bladeconnected to the transfer arm at a connection point. For example, therobot blade may be configured to receive the semiconductor wafer 704from the adaptive inset 106 and to hold the semiconductor wafer 704 asthe transfer arm moves the robot blade from the adaptive inset 106 tothe processing element 716, where the semiconductor wafer 704 is removedfrom the robot blade. In some embodiments, the semiconductor processingtool 708 may comprise a control unit 718 configured to coordinateoperation of the wafer transfer robot 714 and the processing element716.

In various embodiments, the processing element 716 may be configured toperform a semiconductor fabrication process (e.g., a deposition, anetch, a lithographic process, etc) on the semiconductor wafer 704. Insome embodiments, the processing element 716 may comprise aself-assembled monolayer (SAM) deposition tool. The SAM deposition toolis configured to form a SAM on a surface of the semiconductor wafer 704by way of one or more deposition processes. In some embodiments, theprocessing element 716 may comprise a wafer chuck 717 that has theability to hold a wafer have a diameter that is greater than a diameterof plurality of the semiconductor wafer 704. For example, the waferchuck 717 may have the ability to hold a 300 mm wafer, while thesemiconductor wafer 704 may comprise a 200 mm wafer. The wafer chuck 717is configured to hold the semiconductor wafer 704 while thesemiconductor fabrication process is performed.

Once the processing element 716 has performed a semiconductorfabrication process on a wafer, the wafer transfer robot 714 isconfigured to transfer the processed wafer 720 from the processingelement 716 to the adaptive inset 106 in the wafer cassette 102. Onceprocessing on semiconductor wafers within the adaptive inset 106 iscompleted, the wafer cassette 102 is then removed from the loading port712.

FIG. 8 illustrates a flow diagram of some embodiments of a method 800 ofsemiconductor processing that transfers semiconductor wafers using awafer cassette system having an adaptive inset configured to holdsemiconductor wafers.

While method 800 is illustrated and described below as a series of actsor events, it will be appreciated that the illustrated ordering of suchacts or events are not to be interpreted in a limiting sense. Forexample, some acts may occur in different orders and/or concurrentlywith other acts or events apart from those illustrated and/or describedherein. In addition, not all illustrated acts may be required toimplement one or more aspects or embodiments of the description herein.Further, one or more of the acts depicted herein may be carried out inone or more separate acts and/or phases.

At 802, an adaptive inset having a second plurality of wafer slots witha second size is fastened into an interior cavity of a wafer cassettehaving a first plurality of wafer slots with a first size. The secondsize of the second plurality of wafer slots is smaller than the firstsize of the first plurality of wafer slots.

At 804, a semiconductor wafer is transferred into one of the secondplurality of wafer slots of the adaptive inset. In some embodiment, thewafer may be transferred from a fabrication tool, or a wafer cassettehaving wafer slots with the second size, by an automated wafer transfertool.

At 806, the wafer cassette and adaptive inset are transported to asemiconductor processing tool.

At 808, the semiconductor wafer is transferred from the adaptive insetto a processing element within the semiconductor processing tool.

At 810, a fabrication process is performed on the semiconductor wafer bythe processing element. In some embodiments, the fabrication process maycomprise forming a self-assembled monolayer on the semiconductor wafer,at 812.

At 814, the semiconductor wafer is transferred from the processingelement into one of the second plurality of wafer slots of the adaptiveinset.

Therefore, the present disclosure relates to a wafer cassette comprisingan adaptive inset configured to enable semiconductor wafers having afirst diameter to be held by a wafer cassette configured to holdsemiconductor wafers having a second diameter that is larger than thefirst diameter.

In some embodiments, the present disclosure relates to a wafer cassettesystem. The wafer cassette system comprises a wafer cassette having afirst plurality of wafer slots respectively configured to receive asemiconductor wafer having a first diameter. The wafer cassette systemfurther comprises an adaptive inset arranged in an interior cavity ofthe wafer cassette and having a second plurality of wafer slotsrespectively configured to receive a semiconductor wafer having a seconddiameter that is smaller than the first diameter.

In other embodiments, the present disclosure relates to a wafer cassettesystem. The wafer cassette system comprises a wafer cassette comprisinga first plurality of wafer slots respectively having a first width. Thewafer cassette system further comprises an adaptive inset fastened tothe wafer cassette in a rigid connection and having a second pluralityof wafer slots respectively having a second width that is less than thefirst width.

In yet other embodiments, the present disclosure relates to a method oftransporting semiconductor wafers. The method comprises transferring asemiconductor wafer into one of a second plurality of wafer slots withinan adaptive inset arranged within an interior cavity of a wafer cassettehaving a first plurality of wafer slots. The method further comprisestransporting the wafer cassette and the adaptive inset into a loadingport of a semiconductor processing tool configured to perform afabrication process on the semiconductor wafer.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of transporting a semiconductor wafer,comprising: transferring a semiconductor wafer into a first wafer slotof a second plurality of wafer slots within an adaptive inset, whereinthe adaptive inset is arranged within an interior cavity of a wafercassette having a first plurality of wafer slots while transferring thesemiconductor wafer into the first wafer slot; and transporting thewafer cassette and the adaptive inset into a loading port of asemiconductor processing tool configured to perform a fabricationprocess on the semiconductor wafer.
 2. The method of claim 1, whereinthe adaptive inset has a first size and the wafer cassette has a secondsize that is greater than the first size.
 3. The method of claim 1,further comprising: transferring the semiconductor wafer from theadaptive inset to a processing element within the semiconductorprocessing tool while the adaptive inset is within the wafer cassette.4. The method of claim 1, further comprising: fastening the adaptiveinset into the interior cavity of the wafer cassette prior totransferring the semiconductor wafer into the first wafer slot of thesecond plurality of wafer slots.
 5. The method of claim 1, wherein thefirst plurality of wafer slots are stacked in a first direction; andwherein the adaptive inset is inserted into the wafer cassette along asecond direction that is perpendicular to the first direction.
 6. Themethod of claim 1, wherein the semiconductor processing tool comprises aself-assembled monolayer (SAM) deposition tool.
 7. The method of claim1, wherein the adaptive inset is fastened to the wafer cassette by wayof one or more screws.
 8. The method of claim 1, wherein an openingextends along a line through the wafer cassette and the adaptive inset.9. The method of claim 1, wherein the adaptive inset is a second wafercassette configured to hold a smaller wafer than the wafer cassette. 10.A method of transporting semiconductor substrates, comprising: fasteningan adaptive inset having a second plurality of substrate slots into aninterior cavity of a cassette having a first plurality of substrateslots; and transferring a semiconductor substrate into one of the secondplurality of substrate slots of the adaptive inset while the adaptiveinset is fastened into the interior cavity of the cassette.
 11. Themethod of claim 10, further comprising: transferring the semiconductorsubstrate from the adaptive inset to a semiconductor processing toolwhile the adaptive inset is fastened into the interior cavity of thecassette.
 12. The method of claim 11, wherein a substrate transfer robotis configured to transfer the semiconductor substrate from the adaptiveinset to the semiconductor processing tool.
 13. The method of claim 10,wherein the adaptive inset is fastened to the cassette by way of one ormore screws.
 14. The method of claim 13, wherein the one or more screwsextend through a support structure disposed between an interior surfaceof the cassette and an exterior surface of the adaptive inset.
 15. Themethod of claim 10, wherein an opening extends through the cassette andthe adaptive inset after the adaptive inset has been fastened to thecassette, the opening configured to receive the semiconductor substrate.16. The method of claim 15, wherein the opening has a first width thatis larger than a second width of the semiconductor substrate.
 17. Amethod of transporting semiconductor substrates, comprising:transferring a semiconductor substrate into one of a second plurality ofsubstrate slots within an adaptive inset that is fastened to a cassette,wherein the cassette has a first plurality of substrate slots with afirst size that is larger than a second size of the second plurality ofsubstrate slots; and transporting the semiconductor substrate withinboth the cassette and the adaptive inset.
 18. The method of claim 17,further comprising: transferring the semiconductor substrate from theadaptive inset to a processing element.
 19. The method of claim 17,wherein the semiconductor substrate is separated from the secondplurality of substrate slots by a non-zero distance.
 20. The method ofclaim 17, wherein the semiconductor substrate is separated from thesecond plurality of substrate slots by the adaptive inset.